1/1
Custom quality SIC silicon carbide wafers
custom-quality-sic-silicon-carbide-wafers
custom-quality-sic-silicon-carbide-wafers
Contents
xinkehui takes pride in being a detail-oriented and innovative wafer dicing service provider. The wafer dicing services we provide are also known as wafer cutting, die singulation, mechanical dicing, or mechanical sawing.
We are committed to providing superior customer service, while utilizing advanced technology and processes. This allows us to decrease the costs to our customers and increase the quality of their product. Each wafer will be diced with specially customized parameters to minimize yield loss. We utilize Loadpoint dicing saws, which have Windows based operating systems, allowing us to easily use techniques such as multi-pass cuts, ramp up table/ feed rates, and plunge cuts. We also keep in stock a variety of blade types, which allow us to process different materials and thicknesses while maintaining cut quality.
We can accept orders ranging from a single wafer or substrate to hundreds of wafers per month. We have experience working with virtually every type of material in the industry including alumina, AlN, GaAs, GaP, GaN (gallium nitride), fused silica, glass, quartz, germanium, SiC, lexan, PZT, sapphire, SOI, and silicon wafers. We have high pressure wash stations that allow us to effectively clean wafers after the dicing process. We also utilize multiple tape vendors to meet our customers’ specifications, and our UV exposure capability allows us to cure tape prior to shipping. We also have processes in place to help with staining and undesirable metal plating caused by galvanic erosion or corrosion.
http://custom-quality-sic-silicon-carbide-wafers
Customzied size/2inch/3inch/4inch/6inch 6H-N/4H-SEMI/ 4H-N SIC ingots/High purity 4H-N 4inch 6inch dia 150mm silicon carbide single crystal (sic) substrates wafersS/ Customzied as-cut sic wafersProduction 4inch grade 4H-N 1.5mm SIC Wafers for seed crystal
About Silicon Carbide (SiC)Crystal
Silicon carbide (SiC), also known as carborundum, is a semiconductor containing silicon and carbon with chemical formula SiC. SiC is used in semiconductor electronics devices that operate at high temperatures or high voltages, or both.SiC is also one of the important LED components, it is a popular substrate for growing GaN devices, and it also serves as a heat spreader in high-power LEDs.
1.4Inch prime Grade 4H-N 1.5mm SIC Silicon Carbide Wafer Description
4Inch prime Grade 4H-N 1.5mm SIC Silicon Carbide Wafer-product information
4H-N 4inch diameter Silicon Carbide (SiC) Substrate Specification
About company services and products
The following are our wafer dicing capabilities:
We have the following electrostatic discharge (ESD) preventions in place:
Production display show
